Leadframe

常見(jiàn)例句

• This small footprint package is lead (Pb) free, with 100% matte tin leadframe plating.
  該小型封裝為無(wú)鉛產(chǎn)品,且引腳框采用100%25霧錫電鍍。
• The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes.
  引腳架采用100%25霧錫電鍍,可與標(biāo)準(zhǔn)無(wú)鉛印刷電路板裝配流程兼容。
• Effects of thermo-mechanical treatment(TMT) on microstructure and properties of C194 copper alloy leadframe materials were investigated.
  研究了形變熱處理對(duì)C194銅合金引線框架材料組織和性能的影響。
• It is available in a lead (Pb) free (leadframe plating 100% matte tin) 6-pin MLP microleadframe package for surface mount, with exposed pad for enhanced thermal dissipation.
  該器件采用供表面安裝的無(wú)鉛(引腳框是100%25霧錫電鍍)6引腳MLP微型引腳框封裝,并帶有外露散熱板以增強(qiáng)散熱功能。
• This thesis researches to address the occurrence of delamination phenomenon between the interface of molding compound and the copper leadframe die paddle during assembly process.
  中文摘要本論文主要針對(duì)銅釘架在經(jīng)過(guò)封裝制程其本身與膠餅間所產(chǎn)生的脫層現(xiàn)象做研究。
• Navin Bhandarkar,Lim Thiam Beng,1996,”Low-Stress Leadfram Design for Plastic IC Package ”, IEEE Electronic Component and Technology Conference, pp.803-807.
  黃俊琦,2003年,”薄型電子構(gòu)裝晶片應(yīng)力分析與晶片可靠性設(shè)計(jì)研究”,國(guó)立云林科技大學(xué)機(jī)械工程所碩士論文。
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