ball-grid

基本解釋

Desirable for high-performance Ball Grid Array (BGA) package.
高性能球形焊點(diǎn)陣列封裝需要倒裝焊。
In this example, the area of the ball grid array (BGA) deposit appears normal but actually contains more than twice the expected volume and height.
在這個(gè)例子里，球柵陣列(BGA)焊膏沉積面積正常，但實(shí)際焊膏量大于期望量和期望高度的2倍。
Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard.
按照J(rèn)EDEC標(biāo)準(zhǔn)對(duì)板級(jí)跌落實(shí)驗(yàn)的要求測(cè)試了有鉛和無(wú)鉛焊點(diǎn)的球柵陣列封裝。
The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC).
釬料凸臺(tái)的制造是球柵陣列封裝(BGA, ball grid array)、芯片尺寸級(jí)封裝(CSP, chip scale packaging)及倒裝芯片封裝(FC, flip chip)等面陣封裝的關(guān)鍵技術(shù)之一。
This thesis considers the delamination behaviors between substrate and molding compound for Ball Grid Array (BGA) products caused by the plasma etching process.
中文摘要本文針對(duì)陣列錫球封裝產(chǎn)品基板和膠餅間所產(chǎn)生的分層作研究。