bond pad

基本解釋

To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.
為了用較小的規(guī)模模擬相對較長的金線和較大的焊盤，提出了一種溫度場分析的等效方法。
Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).
鈍化層（18）和聚酰亞胺層（22）將最后的互連層（16）和接合焊盤（28）隔開。
ip.com
A semiconductor device (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).
一種半導體器件（10），具有在最后的互連層（16）和接合焊盤之間的接觸，該接合焊盤包括接合焊盤（28）和最后的互連層（16）之間的阻擋金屬（26）。
ip.com