bonding lead

基本解釋

This paper introduces in detail the component and technology process of printed circuit board hand tin-lead bonding of auto instrument.
詳細(xì)介紹了汽車(chē)儀表印刷電路板手工錫焊的組成要素及工藝過(guò)程。
It seemed that higher lead absorption by the fetus was related to the newly emerged lead bonding site in fetus, especially during the calcification of bones.
胎鼠體鉛含量于妊娠后期較前期明顯增加；胎鼠鉛含量隨胎齡的增加可能與妊娠后期胎鼠體內(nèi)不斷出現(xiàn)新的鉛結(jié)合位點(diǎn)，特別是骨骼鈣化有關(guān)。
A laser bonding device can rapidly and conveniently remove a cover layer on a lead with cover layer and perform the laser bonding on the lead and a terminal.
一種激光焊接裝置，能夠迅速且方便地進(jìn)行帶覆層導(dǎo)線的覆層除去作業(yè)、對(duì)該帶覆層導(dǎo)線和端子的激光焊接作業(yè)。
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