flip chip bonding

基本解釋

• 倒裝焊接

英漢例句

雙語(yǔ)例句

• To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
  熱超聲倒裝鍵合作為前沿封裝技術(shù)具有良好的發(fā)展前景。
• With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
  采用多普勒激光振動(dòng)測(cè)量系統(tǒng)，獲得了熱超聲倒裝鍵合過(guò)程中工具末端及芯片的振動(dòng)速度曲線。

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詞組短語(yǔ)

短語(yǔ)

• Direct flip -chip bonding 直接倒裝芯片接合
• Flip -chip-bonding equipment 倒裝焊設(shè)備
• ultrasonic flip -chip bonding 超聲倒裝焊
• thermosonic flip -chip bonding 熱超聲倒裝鍵合
• flip -chip-bonding technique 倒裝焊技術(shù)

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專業(yè)釋義

電子、通信與自動(dòng)控制技術(shù)

• 倒裝式接合（法）
• 倒裝焊接（法）