lead-frame

常見(jiàn)例句

The microstructure and performance of lead-frame copper alloy of C72500 as-cast was studied.
研究了C72500鑄態(tài)銅合金引線框架材料的微觀組織和性能。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
該器件提供兩種封裝：32引腳架構(gòu)芯片級(jí)封裝（LFCSP）和25引腳晶圓級(jí)芯片規(guī)模封裝（WLCSP）。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超聲鋁絲焊接機(jī)和超聲金絲球焊接機(jī)主要運(yùn)用于半導(dǎo)體生產(chǎn)后工序中芯片焊盤(pán)與外框架間引線的焊接。
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