semiconductor bonding wafer

基本解釋

Anodic bonding technology of semiconductor silicon and glass wafer is key technology of MEMS. As one of the key materials, there is a broad industrial applied future about anodic bonding glass.
半導(dǎo)體硅與玻璃的靜電鍵合技術(shù)是微電子機(jī)械系統(tǒng)（MEMS）的關(guān)鍵技術(shù)，而作為關(guān)鍵材料之一的靜電鍵合玻璃有著廣闊的工業(yè)應(yīng)用前景。
Without any kind of glue, wafer bonding technology is able to integrate two polished semiconductor wafers and thus be used widely in fields like micro-electronics micro-mechanics and optoelectronics.
晶圓鍵合可以使得經(jīng)過拋光的半導(dǎo)體晶圓在不使用粘結(jié)劑的情況下結(jié)合在一起。