silver paste

基本解釋

Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.
分析了功率型LED熱阻系統(tǒng)的構成，對采用銀漿和環(huán)氧膠作為芯片鍵合材料的功率型LED熱阻進行了對比研究。
At present, rear-side aluminum paste has been basically achieved localization, localization rate of rear-side silver paste is rising.
目前背面鋁漿已經(jīng)基本實現(xiàn)國產(chǎn)化，背面銀漿的國產(chǎn)化率也在提升。
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The experiment of looking for matching glass paste and silver paste, adjusting technology to obtaining glass sealed chip NTC thermistor were introduced.
為此調整了玻璃釉包覆片式NTC熱敏電阻器所進行的工藝，進行了玻璃漿及銀漿的選取和匹配工作。