solder paste

常見(jiàn)例句

Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：應(yīng)用加熱金屬涂敷層的表面和預(yù)涂焊膏，熔融，連接和凝固兩個(gè)金屬涂層。
The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考慮其他焊膏印刷性能影響因素下，較高的印刷速度和印刷壓力能提高焊膏印刷性能。
Equipment specifically designed for use with solder paste.
于專為錫膏設(shè)計(jì)的設(shè)備中使用。