solder paste technology

基本解釋

It is believed that JetPrinting will more be adopted in electronics assembly, and will also be a competitive solder-paste printing technology.
可以確信焊膏噴印將會被更多地應(yīng)用于電子組裝上，成為一種具有競爭力的焊膏印刷技術(shù)。
The uniformity parameters of solder paste can be extracted by this system, which is competent for the quality control of surface mount technology(SMT) product line.
建構(gòu)了電路板錫膏的三維測量系統(tǒng)，實現(xiàn)了印刷錫膏均勻性參數(shù)的獲取，從而達到對表面貼裝質(zhì)量進行監(jiān)控和評價的目的。