wafer dicing saw
常見例句
- The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
從全自動劃片機的工作機理出發(fā)，分析空氣靜壓電主軸、晶圓傳輸定位、自動對準(zhǔn)、自動清洗等全自動劃片機的關(guān)鍵技術(shù)； 返回 wafer dicing saw