wet gate oxidation process
常見例句
- Started with silicon wafer our TFFEC processes consist of wet isotropic chemical etching for cone formation, oxidation and etching for tip sharpening and self-aligned gate process.
我們用硅材料為基體，用各向同性的濕法化學(xué)腐蝕工藝制出尖端，用氧化增尖和自對(duì)準(zhǔn)柵極工藝制成TFFEC—薄膜場發(fā)射陰極。 返回 wet gate oxidation process