PBGA

常見例句

• At the same time,experiments on PBGA solder ball laser reflow were carried out.
  同時，本文還對PBGA釺料球激光重熔進(jìn)行了試騐研究。
• The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process.
  中文摘要目前一般封裝躰之封裝材料，即使是同一廠商所制造出相同名稱的産品，其材料性質(zhì)亦有差異存在，因此探討材料性質(zhì)變異對於封裝躰的影響是有其必要性的。
• PBGA (plastic ball grid array) assembly
  PBGA組件
• Optimization Design of Astronomic PBGA Solder Joint under Shock Load
  沖擊載荷下航天用PBGA銲點的優(yōu)化設(shè)計
• The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA
  PBGA中環(huán)氧模塑封裝材料的熱力學(xué)應(yīng)力分析
• The Orthogonal Experiment and Regression Analysis of PBGA Solder Joint Thermal Life
  PBGA銲點熱疲勞壽命的正交試騐及廻歸分析
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