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Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自動(dòng)粘片機(jī)是將半導(dǎo)躰晶圓微芯片貼裝到引線基架的半導(dǎo)躰後工序關(guān)鍵性生産設(shè)備。