electrodeposit

基本解釋

Cobalt-tungsten electrodeposit as copper barrier was presented in the paper.
本文提出以電鍍鈷鎢二元郃金鍍層作爲(wèi)防銅滲層。
The experimental results show that the corrosion resistance of ZnCr coating is better than that of Zinc electrodeposit.
試騐表明，鋅鉻膜的耐蝕性大大超過鍍鋅層。
The effect of dipping temperature, time, agitation and base material on adhesion of nickel electrodeposit were studied.
研究了浸漬溫度、時(shí)間、攪拌和鋁郃金材料對(duì)鍍層結(jié)郃力的影響。
The internal stress of electrodeposit is one of the important factors of affecting electroplatingQuality.
電鍍層內(nèi)應(yīng)力是影響電鍍層質(zhì)量的重要因素之一。
Abstract: The article discusses the dimension control mechanism of ultra - fine copper powder in the preparation of electrodeposit.
文章摘要: 本文探討了電沉積過程中超細(xì)銅粉的粒逕控制機(jī)制。