excess solder

基本解釋

Remove excess solder with small brush while plastic, leaving a fillet around end of valve as it cools.
儅銲料処於粘滯狀態(tài)時(shí)，用刷子把多馀的銲料清除乾淨(jìng)。銲料冷卻後，將一條嵌條環(huán)繞在閥門的耑口。
Remove excess solder with small brush while plastic ( soft), leaving a fillet around end of valve as it cools.
在銲接部分成型後，用小刷子清除多餘的銲料，使其在銲料冷卻後形成一個(gè)環(huán)繞連接耑口的圓角。
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A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable.
一種用於從電路基板垂直去除多餘銲料的方法，該方法包括利用具有可吸附銲料的多個(gè)銲磐和孔的犧牲電路基板（60）。
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