high-aspect-ratio

基本解釋

A novel pressure sensor based on a high-aspect-ratio structure formed by SU-8 photoresist is proposed.
主要提出了一種利用SU-8光刻膠形成高深寬比結(jié)搆的新型壓力傳感器。
Recently, lithograph of thick resist has been regarded as an effective and economical technology for manufacturing excellent high-aspect-ratio microstructures (HARMS).
近年來(lái)，作爲(wèi)制作優(yōu)質(zhì)大高寬比微結(jié)搆的厚層抗蝕劑光刻術(shù)以其工藝簡(jiǎn)單、制作成本低等優(yōu)點(diǎn)受到國(guó)際上廣泛重眡。
With the rapid development of MEMS, being the first choice photoresist for the fabrication of high-aspect-ratio structure, SU-8 photoresist has been widely applied to the research field of MEMS.
隨著微機(jī)電系統(tǒng)（MEMS）的迅速發(fā)展，SU-8光刻膠作爲(wèi)制作高深寬比結(jié)搆的首選膠，已經(jīng)被廣泛地應(yīng)用於MEMS研究領(lǐng)域。

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