void-free

基本解釋

EM900 is packaged void free to insure consistent dispensing in high speed automated processes.
EM900採(cǎi)用無空隙包裝,以便確保在高速工藝過程中點(diǎn)膠的一致性。
It provides a uniform and void free underfill layer, which gives excellent protection of printed circuit boards from soldering failure due to impact and thermal cycling.
它能形成一致和無缺陷的底部填充層，能有傚降低由於矽芯片與基板之間的縂躰溫度膨脹特性不匹配或外力造成的沖擊。
Reading occupies most of my free time.
閲讀佔(zhàn)去了我大部分的閑暇時(shí)間。
Celestials live in the great void.
仙人生活在太虛之中。
The crew remained free from scurvy.
那些船員仍然沒有患?jí)难≈荨?/li>