polishing slurry

基本解釋

Chemical mechanical polishing Rough surface Microscale flow Polishing slurry;
化學機械拋光；粗糙表面；微尺度流動；拋光液；
Laser inducement fluorescence (LIF) is used to study the effect of polishing parameters on slurry film thickness.
本文采用激光誘導熒光技術(shù)（LIF）來研究拋光參數(shù)對化學機械拋光加工區(qū)液膜厚度的影響。
Single stage re-circulation filtrations were performed to remove oversized particles from colloidal silica based Chemical-Mechanical Polishing(CMP)slurry.
單步循環(huán)過濾，用來去除膠體硅基化學機械拋光（CMP）磨料中尺寸過大的微粒。