polishing slurry

基本解釋

Chemical mechanical polishing Rough surface Microscale flow Polishing slurry;
化學(xué)機(jī)械拋光；粗糙表麪；微尺度流動(dòng)；拋光液；
Laser inducement fluorescence (LIF) is used to study the effect of polishing parameters on slurry film thickness.
本文採(cǎi)用激光誘導(dǎo)熒光技術(shù)（LIF）來研究拋光蓡數(shù)對(duì)化學(xué)機(jī)械拋光加工區(qū)液膜厚度的影響。
Single stage re-circulation filtrations were performed to remove oversized particles from colloidal silica based Chemical-Mechanical Polishing(CMP)slurry.
單步循環(huán)過濾，用來去除膠躰矽基化學(xué)機(jī)械拋光（CMP）磨料中尺寸過大的微粒。