thermal impedance

基本解釋

Using a same semiconductor laser scheme, the thermal impedance of diamond thermal management is only 40% of A1N thermal management.
采用完全相同的半導體激光器結(jié)構(gòu)金剛石膜熱沉的熱阻僅為氮化鋁熱沉的40％。
Using a same semiconductor laser scheme, the thermal impedance of diamond thermal management is only 40% of AlN thermal management.
采用完全相同的半導體激光器結(jié)構(gòu)，金剛石膜熱沉的熱阻僅為氮化鋁熱沉的4 0 % 。
The effect of dielectric constant, dielectric loss factor, coefficient of thermal expansion (CTE)and characteristic impedance of substrate materials on properties of MMB are mainly discussed.
介紹了微波多層板所用基材的性能參數(shù)，重點闡述了材料的介電常數(shù)、介質(zhì)損耗、熱脹系數(shù)、特性阻抗對多層板性能的影響。