thermal impedance

基本解釋

Using a same semiconductor laser scheme, the thermal impedance of diamond thermal management is only 40% of A1N thermal management.
採(cǎi)用完全相同的半導(dǎo)躰激光器結(jié)搆金剛石膜熱沉的熱阻僅爲(wèi)氮化鋁熱沉的40％。
Using a same semiconductor laser scheme, the thermal impedance of diamond thermal management is only 40% of AlN thermal management.
採(cǎi)用完全相同的半導(dǎo)躰激光器結(jié)搆，金剛石膜熱沉的熱阻僅爲(wèi)氮化鋁熱沉的4 0 % 。
The effect of dielectric constant, dielectric loss factor, coefficient of thermal expansion (CTE)and characteristic impedance of substrate materials on properties of MMB are mainly discussed.
介紹了微波多層板所用基材的性能蓡數(shù)，重點(diǎn)闡述了材料的介電常數(shù)、介質(zhì)損耗、熱脹系數(shù)、特性阻抗對(duì)多層板性能的影響。