ultrasonic bonding

基本解釋

Pitching vibration of ultrasonic bonding transducer can affect the bonding quality of IC.
以超聲鍵合換能系統(tǒng)為研究對象，分析了其俯仰振動對超聲鍵合質(zhì)量的影響。
The characteristics of bonding force in the ultrasonic bonding process were also studied.
在超聲引線鍵合過程中，鍵合壓力是影響鍵合強(qiáng)度的重要因素之一。
Aluminum wire ultrasonic bonding; transducer drive current; signal time-frequency analysis; feature selecting; quality online monitoring.
粗鋁絲超聲引線鍵合；換能器驅(qū)動電流；信號時頻分析；特征提?。?質(zhì)量在線監(jiān)測。
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超聲鍵合
Nowadays, ultrasonic bonding, which including wire bonding and thermosonic flip chip bonding, are the main packaging processes for manufacturing semiconductor products.
當(dāng)前,包括單點引線與多點倒裝的超聲鍵合構(gòu)成半導(dǎo)體器件的主要封裝形式。
超聲波粘合
超聲波鍵合
超聲波結(jié)合

超聲鍵合
The frequency spectrums of force response were obtained through output force signals of dynamic force sensor. These experiment phenomena and results are helpful to studied on bonding parameters matching and optimization in ultrasonic bonding.
利用壓力傳感器輸出壓力響應(yīng)信號，得到壓力響應(yīng)曲線的頻譜圖，實驗分析鍵合壓力參數(shù)對超聲功率參數(shù)的匹配，對今后超聲鍵合過程參數(shù)的匹配及優(yōu)化具有一定的指導(dǎo)意義。
超聲波粘合
超聲波焊接
超聲（波）焊接（法）
超音波結(jié)合