ultrasonic bonding

常見例句

Pitching vibration of ultrasonic bonding transducer can affect the bonding quality of IC.
以超聲鍵合換能系統(tǒng)為研究對(duì)象，分析了其俯仰振動(dòng)對(duì)超聲鍵合質(zhì)量的影響。
The characteristics of bonding force in the ultrasonic bonding process were also studied.
在超聲引線鍵合過程中，鍵合壓力是影響鍵合強(qiáng)度的重要因素之一。
Aluminum wire ultrasonic bonding; transducer drive current; signal time-frequency analysis; feature selecting; quality online monitoring.
粗鋁絲超聲引線鍵合；換能器驅(qū)動(dòng)電流；信號(hào)時(shí)頻分析；特征提??；質(zhì)量在線監(jiān)測(cè)。
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